grinding of silicon wafers a literature review

grinding of silicon wafers a literature review

SIMULTANEOUS DOUBLESIDE GRINDING OF SILICON WAFERS: A ...

Simultaneous doubleside grinding (SDSG) has become an important flattening process for manufacturing of 300 mm silicon wafers. However, the literature contains only a small number of papers on SDSG. In contrast, there are a large number of patents pertinent to this process. There is no review ...

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Article: Wheel wear mechanisms for silicon grinding: a ...

Abstract: Grinding is an important flattening process for manufacturing of silicon wafers. The wear of grinding wheels has significant impacts on the manufacturing cost of silicon wafers and the quality of ground wafers. However, a thorough literature search has not resulted in any studies on wheel wear mechanisms in silicon grinding.

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Simultaneous double side grinding of silicon wafers: a ...

The literature review has revealed at least two possible topics for future research on SDSG of silicon wafers: a systematic study on grinding marks and a more sophisticated model to predict the wafer shape.

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Grinding wheels for manufacturing of silicon wafers: A literature review January 2007 International Journal of Machine Tools and Manufacture Grinding is an important process for manufacturing of silicon wafers The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used,

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Wheel wear mechanisms for silicon grinding: a literature ...

Grinding is an important flattening process for manufacturing of silicon wafers. The wear of grinding wheels has significant impacts on the manufacturing cost of silicon wafers and the quality of ground wafers. However, a thorough literature search has not resulted in any studies on wheel wear mechanisms in silicon grinding.

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Grinding of silicon wafers A review from historical . It is intended to help readers to gain a more comprehensive view on grinding of silicon wafers, and to be instrumental for research and development in grinding of wafers made from other materials (such as gallium arsenide, germanium, lithium niobate, sapphire, and silicon carbide).

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ELID grinding of silicon wafers: A literature review (PDF, Official FullText Publication: ELID grinding of silicon wafers: A literature review on ResearchGate, the professional network for scientists, International Journal of Machine Tools and Manufacture (Impact Factor: 274) 03/2007.

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Simultaneous double side grinding of silicon wafers: a ...

Simultaneous double side grinding of silicon wafers: a literature review Z.C. Li a, Z.J. Pei a,, Graham R. Fisher b a Department of Industrial and Manufacturing Systems Engineering, Kansas State University, Manhattan, KS 66506, USA

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SIMULTANEOUS DOUBLESIDE GRINDING OF SILICON WAFERS: A ...

Simultaneous doubleside grinding (SDSG) has become an important flattening process for manufacturing of 300 mm silicon wafers. However, the literature contains only a small number of papers on SDSG. In contrast, there are a large number of patents pertinent to this process.

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Grinding wheels for manufacturing of silicon wafers: A ...

Grinding wheels for manufacturing of silicon wafers: A literature review The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used in the silicon wafer industry.

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Read ELID grinding of silicon wafers: a literature review

Grinding is one of the important methods in manufacturing of silicon wafers and in thinning of completed device wafers. Fig. 2 illustrates the wafer grinding process. This wafer grinding process is referred to conventional wafer grinding in this paper.

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Grinding wheels for manufacturing of silicon wafers: A ...

Simultaneous double side grinding of silicon wafers: a literature review. Manhattan, KS 66506, USA 1 Simultaneous double side grinding of silicon wafers: a literature review Z.C. Li a, Z.J. Pei a, Graham R. Fisher b a Department of Industrial and Ma...

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Grinding wheels for manufacturing of silicon wafers: A ...

This paper presents a literature review on grinding wheels for manufacturing of silicon wafers. It discusses recent development in abrasives, bond materials, porosity formation, and geometry design of the grinding wheels to meet the stringent requirements.

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Machining processes for sapphire wafers: a literature review

This paper reviews the literature on various machining processes for sapphire wafers: slicing (including outer diameter cutoff grinding, inner diameter cutoff grinding, loose abrasive multiwire sawing, fixed abrasive slicing, and fixed abrasive multiwire sawing), flattening (including lapping and grinding), and surface finishing (including mechanical polishing and chemical mechanical polishing).

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Grinding wheels for manufacturing of silicon wafers: A ...

Simultaneous double side grinding of silicon wafers: a literature review. Manhattan, KS 66506, USA 1 Simultaneous double side grinding of silicon wafers: a literature review Z.C. Li a, Z.J. Pei a, Graham R. Fisher b a Department of Industrial and Ma...

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wafers: a literature review, International Journal of Machine Tools and In recent years, research has been done on electrolytic inprocess dressing (ELID) However, ELID grinding has not been accepted by the silicon wafer industry as a ..

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SIMULTANEOUS DOUBLESIDE GRINDING OF SILICON WAFERS: A ...

Simultaneous doubleside grinding (SDSG) has become an important flattening process for manufacturing of 300 mm silicon wafers. However, the literature contains only a small number of papers on SDSG. In contrast, there are a large number of patents pertinent to this process.

Get A Free Quote

Read ELID grinding of silicon wafers: a literature review

Grinding is one of the important methods in manufacturing of silicon wafers and in thinning of completed device wafers. Fig. 2 illustrates the wafer grinding process. This wafer grinding process is referred to conventional wafer grinding in this paper.

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Grinding wheels for manufacturing of silicon wafers: A ...

The stringent requirements for these grinding wheels include low damage on ground surfaces, selfdressing ability, consistent performance, long wheel lives, and low prices. This paper presents a literature review on grinding wheels for manufacturing of silicon wafers.

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Grinding wheels for manufacturing of silicon wafers: A ...

Grinding wheels for manufacturing of silicon wafers: A literature review The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used in the silicon wafer industry.

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Grinding of silicon wafers: A review from historical ...

Grinding of silicon wafers: A review from historical perspectives Article in International Journal of Machine Tools and Manufacture 48(1213):12971307 · October 2008 with 1,406 Reads

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CiteSeerX — ELID grinding of silicon wafers: a literature ...

@MISC{A_elidgrinding, author = {J. H. Liu A and Z. J. Pei A and Graham R. Fisher B}, title = {ELID grinding of silicon wafers: a literature review}, year = {}} Silicon wafers are the most widely used substrates for fabricating integrated circuits. There have been continuous demands for higher ...

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Simultaneous double side grinding of silicon wafers: a ...

Simultaneous double side grinding of silicon wafers: a literature review The quality of ICs depends directly on the quality of silicon wafers. A series of processes are required to manufacture high quality silicon wafers.

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Grinding Process Wafer

Grinding wheels for manufacturing of silicon ... literature review on grinding wheels for manufacturing of silicon wafers. ... the wafer grinding process.

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grinding machines for silicon

Grinding wheels for manufacturing of silicon wafers: A . · International Journal of Machine Tools & Manufacture 47 (2007) 1–13 Grinding wheels for manufacturing of silicon wafers: A literature review. silicon grinding machine . Plastemart Official Site.

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